A primer on 'flip chip' manufacturing techniques for smart card ICs
Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to substrates via tiny wire bonds, flip chip offers a number of benefits and efficiencies. To get a better understanding of the process, SecureIDNews asked one of the leaders in the field, Dr. George Riley, a man known to many as Dr. Flipchip, to develop a primer on the technology and its use with smart cards and RFID.
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