INSIDE Contactless, TIEMPO partner to produce next generation chip
A partnership between chip maker INSIDE Contactless and TIEMPO, a French company specializing in asynchronous ICs, is looking at designing the next generation chip that incorporates asynchronous technology. The new chip will be designed using TIEMPO’s clockless and delay insensitive engineering.
With the growth of contactless payment, transit, access and ID markets, and demands for faster, lower power and lower cost core technologies to support these markets, INSIDE is trying to move forward with advance chip designs, says INSIDE’s CTO Gary Chew. “We believe that the use of TIEMPO asynchronous design technology can provide significant gains in performance and reduction in power consumption within our products.”
As the first step in this partnership, INSIDE’s and TIEMPO’s collaboration will include expert designers from both companies to design and produce the low-power asynchronous chips. ![[end]](/resources/bullet/contactlessnews-4.gif)
